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1/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. led drivers for lcd backlights backlight led driver for small lcd panels (charge pump type) BD1601MUV description the multi-level brightness control white le d driver not only ensures efficient boost by automatically changing the boost rate but also works as a constant current driver in 64 steps, so that the driving curre nt can be adjusted finely. this ic is best suited to turn on white leds that requ ire high-accuracy led brightness control. features 1) built-in parallel led driver for 4 to 6 lamps. 2) 64-step led current adjust function. 3) inter-led relative cu rrent accuracy: 3% or less 4) lighting/dimming control via a single-line digital control interface. 5) automatic transition charge pump type dc/dc converter (1,1.5 and 2). 6) high efficiency achieved (90% or more at maximum). 7) various protection functions such as output voltage protection, over current limiter and thermal shutdown circuit are mount ed. 8) small qfn package. applications this driver is applicable for various fields such as mobile phones, portable game machines and white goods. absolute maxi mum ratings (ta=25 ) parameter symbol ratings unit power supply voltage vmax 7 v operating temperature range topr -30 ~ +85 storage temperature range tstg -55 ~ +150 power dissipation pd 700 (*1) mw (*1) when a glass epoxy substrate (70m m 70mm 1.6mm) has been mounted, this loss will decrease 5.6mw/ if ta is higher than or equal to 25 . operating conditions (ta = -30 ~ 85 ) parameter symbol ratings unit operating power supply voltage vcc 2.7~5.5 v no.11040ebt22
technical note 2/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV electrical characteristics unless otherwise noted, ta = +25 , vbat=3.6v parameter symbol limits units condition min. typ. max. overall input voltage range v in 2.7 3.6 5.5 v vbat terminal quiescent current i q - 0.1 1 a en=0v current consumption1 i dd1 - 1.0 2.4 ma x1.0 mode, except led current current consumption2 i dd2 - 2.5 3.5 ma x2.0 mode, except led current charge pump oscillator frequency f osc 0.8 1.0 1.2 mhz current source led maximum current i led-max 28.5 30 31.5 ma led current accuracy i led-diff - - 5.0 % when led current 15.5ma setting and led terminal voltage 1.0v led current matching (*1) i led-match - 0.5 3.0 % when led current 15.5ma setting and led terminal voltage 1.0v led control voltage v led - 0.2 0.25 v minimum voltage at led1~led4 pins logic control terminal low threshold voltage v il - - 0.4 v high threshold voltage v ih 1.4 - - v high level input current i ih - 0.1 2 a en=v in low level input current i il -2 -0.1 - a en=0v minimum en high time t hi 50 - - nsec minimum en low time t lo 0.05 - 100 sec en off timeout t off - 512 640 sec (*1) the following expression is used for calculation: i led-match ={(imax-imin)/(imax+imin)} 100 imax= current value in a channel with the maximum current value among all channels imin=current value in a channel with the minimum current value among all channels
technical note 3/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV block diagram 1, 1.5, 2 charge pump over voltage protect osc tsd enable/ brightness control vout control charge pump mode control gnd led1 led2 en vbat vout c1n c1p c2n c2p 6 led3 led4 current dac fig.1 block diagram pin configuration 16 15 14 13 8 7 6 5 4 3 2 1 12 11 10 9 led4 led3 led2 led1 c1p vbat vout nc nc nc en gnd gnd c2p c2n c1n fig. 2 pin configuration
technical note 4/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV pin descriptions pin no. pin name in/out type function 1 nc - - no connect 2 nc - - no connect 3 en in c on/off and dimming control 4 gnd - d gnd 5 nc - - no connect 6 vout out a charge pump output 7 vbat - a power supply 8 c1p in/out a flying capacitor pin positive (+) side 9 c1n in/out b flying capaci tor pin negative (-) side 10 c2n in/out b flying capa citor pin negative (-) side 11 c2p in/out a flying capacitor pin positive (+) side 12 gnd - d gnd 13 led1 out - led current driver output 1 14 led2 out b led current driver output 2 15 led3 out b led current driver output 3 16 led4 out b led current driver output 4 type-a pad gnd type-b pad gnd vbat type-c pad gnd vbat type-d pad vbat fig.3 equivalent circuit diagram for esd
technical note 5/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV typical application circuit white led application(recommended) 1, 1.5, 2 charge pump over voltage protect osc tsd enable/ brightness control vout control charge pump mode control current dac gnd led1 led2 led3 led4 en battery vbat vout c1n c1p c2n c2p c1 c2 cin =1 f cout =1 f 6 vf pulse generator fig. 4 block diagram and recommended circuit example.
technical note 6/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV reference data 0.0 0.4 0.8 1.2 1.6 2.0 2.533.544.555.5 input voltag e: vin[v] quiescent current: iq[ a] ta =25 o c ta =85 o c ta =-3 0 o c fig.5 circuit current (standby) fig.6 circuit current (operation in 1.0mode) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 2.5 3 3.5 4 4.5 5 5.5 input voltg e: vin[v] curr ent consumption: idd1[m a] ta =85 o c ta =-3 0 o c ta =25 o c 40 50 60 70 80 90 100 2.5 3 3.5 4 4.5 5 5.5 input voltag e: vin[v] efficiency [%] down up fig.7 efficiency (20ma 4lights) fig.8 efficiency (5ma 4lights) 0 10 20 30 40 50 60 70 80 90 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5 input voltag e: vin[v] efficiency [%] ta =85 o c ta =-3 0 o c ta =25 o c 0 10 20 30 40 50 60 70 80 90 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5 input voltag e: vin[v] efficiency [%] ta =85 o c ta =-3 0 o c ta =25 o c fig.9 efficiency (15ma 4 lights) fig.10 efficiency (30ma 4lights 0 10 20 30 40 50 60 70 80 90 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 input voltag e: vin[v] efficiency [%] ta =-3 0 o c ta =25 o c ta =85 o c fig.11 led current characteristics (led current 15.5ma) 0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 0.0 0.4 0.8 1.2 1.6 2.0 led voltag e: v led [v] led cur rent [m a] ta =85 o c ta =-3 0 o c ta =25 o c fig.12 led current characteristics (differential linearity error) fig.13 led current characteristics (integral linearity error) -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0 102030405060 state[dec] inl [lsb] ta =-3 0 o c ta =25 o c ta =85 o c fig.14 led current matching fig.15 led current ? input voltage (led current 15.5ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 102030405060 state[dec] led curr ent matching [%] ta =85 o c ta =-3 0 o c ta =25 o c 0.0 2.5 5.0 7.5 10.0 12.5 15.0 17.5 20.0 2.533.544.555.5 input voltag e: vin[v] led cur rent [m a] ta =-3 0 o c ta =25 o c ta =85 o c -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 0 102030405060 state[dec] dnl [lsb] ta =-3 0 o c ta =25 o c ta =85 o c
technical note 7/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV function description (1) led driver ? upic interface BD1601MUV is a single line digital interface control (uni-port interface control=upic) that can control the power on/off and led current value through the en pin only. the led current increments by about 0.5ma depending on the number of leading edges. when the number of leading edge is added at the maximum output current of 30ma (64 leading edges), the current is almost equal to 0.5ma at startup time. to maintain any output current, the en pin must be kept at ?h? level. to power off, the en pin must be kept at ?l? level for more than 640sec. en i led (internal) state c1 c2 c3 c4 c3 1.4ma 1.4ma 1.9ma c5 30ma 29.5ma c63 c64 soft start 0.5ma 2.3ma 0.9ma c1 c2 t hi t lo t off off off fig.16 brightness control method en t hi t lo t off fig.17 upic interface ? led current level the led current state can be changed by the en control signal. when the current level is cn, the basic led current (iled) can be obtained from the following expression (where, n indicates a state number). i led = 30 / 64 n [ma] state output current [ma]] state output current [ma] state output current [ma] state output current [ma] c1 0.5 c14 8.0 c33 15.5 c49 23.0 c2 0.9 c18 8.4 c34 15.9 c50 23.4 c3 1.4 c19 8.9 c35 16.4 c51 23.9 c4 1.9 c20 9.4 c36 16.9 c52 24.4 c5 2.3 c21 9.8 c37 17.3 c53 24.8 c6 2.8 c22 10.3 c38 17.8 c54 25.3 c7 3.3 c23 10.8 c39 18.3 c55 25.8 c8 3.8 c24 11.3 c40 18.8 c56 26.3 c9 4.2 c25 11.7 c41 19.2 c57 26.7 c10 4.7 c26 12.2 c42 19.7 c58 27.2 c11 5.2 c27 12.7 c43 20.2 c59 27.7 c12 5.6 c28 13.1 c44 20.6 c60 28.1 c13 6.1 c29 13.6 c45 21.1 c61 28.6 c14 6.6 c30 14.1 c46 21.6 c62 29.1 c15 7.0 c31 14.5 c47 22.0 c63 29.5 c16 7.5 c32 15.0 c48 22.5 c64 30.0
technical note 8/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV (2) charge pump a) description of operations pin voltage comparison takes place at vout control section, and then vout generaton takes place so that the led cathode voltage with the highest vf is set to 0.2v. a boost ra te is changed automatically to a proper one at the charge pump mode control section so that operation can take place at possible low boost rate. when the current taken from vbat exceeds 600ma, the overcurrent limiter is activated and this ic is reset. in addition, if the output voltage falls below 1.5v, this ic is reset for short-circuit at output. b) soft start function BD1601MUV have a soft start function that prevents the rush current. soft start ordinal mode en/led* vout i led t off fig.18 soft start c) automatic boost rate change the boost rate automatically switches to the best mode. * (1 mode -> 1.5 mode) or (1.5 mode -> 2 mode) if a battery voltage drop occursBD1601MUV cannot maintain the led constant current, and then mode transition begins. * (1.5 mode -> 1 mode) or (2 mode -> 1.5 mode) if a battery voltage rise occurs, vout and vbat detection are activated, and then mode transition begins. (3) uvlo (ultra low voltage lock out) if the input voltage falls below 2.2v, BD1601MUV is shut down to prevent malfunction due to ultra-low voltage. (4) ovp (over voltage protection) this circuit protects this ic against damage when the c/p output voltage (vout) rises extremely for some external factors. (5) thermal shutdown (tsd) to protect this ic against thermal damage or heat-driven uncontrolled operations, this circuit turns off the output if the chip temperature rises over 175 . in addition, it turns on the output if the temperature returns to the normal temperature. because the built-in thermal protection circuit is intended to protect the ic itself, the thermal shutdown detection temperature must be set to below 175 in thermal design. (6) power sequence vbat en fig.19 power sequence
technical note 9/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV application circuit example white led application(vout not used) 1, 1.5, 2 charge pump over voltage protect osc tsd enable/ brightness control vout control charge pump mode control current dac gnd led1 led2 led3 led4 en battery vbat vout c1n c1p c2n c2p cin =1 f cout =1 f 6 pulse generator vf vdd fig. 20 block diagram and circuit example application parts selection method capacitor (use a ceramics capacitor with good frequency and temperature characteristics.) symbol recommended value recommended parts type cout,cin,c1,c2 1 f grm188b11a105ka61b(murata) ceramics capacitor connect an input bypass capacitor cin between vbat and gnd pin and an output capacitor cout between vout and gnd pin in proximity. place both c1p-c1n and c2p-c2n capacitors in proximity to the chip. furthermore, select a ceramics capacitor with a sufficient rating for voltage to be applied. when the parts not listed above are used, the equivalent parts must be used.
technical note 10/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV recommended pcb layout in pcb design, wire the power supply line in a way that the pcb impedance goes low and provide a bypass capacitor if needed. en vout vbat to substrate gnd gnd cin cout c1 c2 to substrate vcc cin c2 c1 gnd vbat vout gnd cout fig.21 application layout image (top view) fig.22 BD1601MUV front (top view)
technical note 11/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV notes for use (1) absolute ma ximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaki ng mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteri stics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can break down ics. take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly che ck to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dro pout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd te rminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient . (6)short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong electromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connected to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establis h a ground for the assembly process and pay thorough attention to the transportation and the storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are inevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it w ill be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. (12) thermal shutdown circuit (tsd) when junction temperatures become 175 (typ) or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolating the lsi from thermal runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefore, do not c ontinuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. (14) coil selection to reduce the loss, select a coil with a small wound resistor for dc/dc converter output.
technical note 12/12 www.rohm.com 2011.06 - rev.b ? 2011 rohm co., ltd. all rights reserved. BD1601MUV ordering part number b d 1 6 0 1 m u v - e 2 part no. part no. package muv: vqfn016v3030 packaging and forming specification e2: embossed tape and reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) vqfn016v3030 1 12 9 16 13 4 8 5 0.5 0.75 0.25 +0.05 ?0.04 1.40.1 1.40.1 0.40.1 c0.2 1.0max 0.02 +0.03 ?0.02 (0.22) 3.00.1 3.00.1 1pin mark 0.08 s s
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